基于两相复合材料的下填体速率特性研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853175

Haiying Wang, Z. Qian, Minfu Lu, Sheng Liu, Jiali Wu, C. Wong

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引用次数: 0

摘要

下填料的性能对倒装芯片封装的可靠性至关重要。作为环氧基材料，下填料在机械载荷作用下表现出明显的速率依赖性。本文基于两相复合假设，研究了底填体的应变-应力速率特性。采用细观力学方法对下填体的整体应变-应力特性进行了预测。结果表明，预测数据与实验数据吻合较好。

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Study on rate-dependent behaviors of underfills based on two-phase composites

Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the rate-dependent strain-stress behavior of underfills is studied based on two-phase composite assumption. A micromechanical method is employed to predict the overall strain-stress behavior of underfills. Results show good agreement between the predicted data and experimental data.

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来源期刊

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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