Yan Huang, Panpan Jiang, Tianhan Liu, Chaohui Liang
{"title":"fpga的eos诱导失效分析","authors":"Yan Huang, Panpan Jiang, Tianhan Liu, Chaohui Liang","doi":"10.1109/EPTC56328.2022.10013170","DOIUrl":null,"url":null,"abstract":"In this article, EOS-induced failures of three FPGAs due to the severe voltage over or under shoots during debugging process are analyzed, based on well designed procedures. The traditional techniques used are capable to pinpoint and characterize the details of EOS-induced failures, this may assist the manufacturers and users to do the provenance-tracking and improve the reliability of FPGAs application.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"EOS-induced failure analysis of FPGAs\",\"authors\":\"Yan Huang, Panpan Jiang, Tianhan Liu, Chaohui Liang\",\"doi\":\"10.1109/EPTC56328.2022.10013170\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this article, EOS-induced failures of three FPGAs due to the severe voltage over or under shoots during debugging process are analyzed, based on well designed procedures. The traditional techniques used are capable to pinpoint and characterize the details of EOS-induced failures, this may assist the manufacturers and users to do the provenance-tracking and improve the reliability of FPGAs application.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013170\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013170","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this article, EOS-induced failures of three FPGAs due to the severe voltage over or under shoots during debugging process are analyzed, based on well designed procedures. The traditional techniques used are capable to pinpoint and characterize the details of EOS-induced failures, this may assist the manufacturers and users to do the provenance-tracking and improve the reliability of FPGAs application.
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