一种新型无结BE-SONOS NAND闪存

H. Lue, E. Lai, Y. Hsiao, S. Hong, M.T. Wu, F. Hsu, N. Z. Lien, S.Y. Wang, L.W. Yang, T. Yang, K.C. Chen, K. Hsieh, R. Liu, Chih-Yuan Lu
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引用次数: 20

摘要

我们已经成功地展示了一种新型无结的BE-SONOS NAND闪存。无结器件极大地改善了短通道效应,从而有望将NAND闪存扩展到20nm以下节点。相邻器件之间留下了非常小的空间(l30nm),而不是S/D结。NAND阵列仅在外部区域形成结,而阵列内部没有结。来自栅极的条纹场在狭窄的空间下反转硅,允许在没有扩散结的情况下传导。使用该技术演示了成功的n通道,p通道和TFT BE-SONOS NAND器件。仿真结果表明,这种新型无结技术可扩展到20nm节点以上。此外,无结器件不受三维TFT器件热收支的影响。这种新器件可以在当前的NAND闪存工艺中实现,而无需引入新的掩模。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel junction-free BE-SONOS NAND flash
We have successfully demonstrated a novel junction-free BE-SONOS NAND Flash. Junction-free devices greatly improve the short channel effect and thus promise scaling of NAND Flash below 20 nm node. Instead of S/D junctions a very small space (Lt 30 nm) is left between adjacent devices. Junction is formed only at the outer region of NAND array, while there is no junction inside the array. Fringe field from the gate inverts the Si under the narrow space allowing conduction without a diffusion junction. Successful n-channel, p-channel and TFT BE-SONOS NAND devices are demonstrated using this technique. Simulation results suggest that this novel junction-free technique is scalable beyond 20 nm node. Moreover, the junction-free devices are unaffected by the thermal budget in the 3D TFT devices. This new device can be implemented in the current NAND Flash process without introducing new masks.
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