电磁场作用下电镀集成电路中的电流分布和热局部化

2000 10th International Crimean Microwave Conference. "Microwave and Telecommunication Technology". Conference Proceedings (IEEE Cat. No.00EX415) Pub Date : 2000-09-11 DOI:10.1109/CRMICO.2000.1256190

Ye.P. Taran, V. Starostenko, Ye.V. Grygoriev, D.E. Lashennikov

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引用次数: 0

摘要

在电磁场的作用下，对电镀中的电流分布特性进行了数值研究。分析了镀层微观降解的机理和边缘效应的成因。

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The current distribution and heat localization in the integrated circuits plating at the effect of electromagnetic fields

The numerical researches on investigation of current distribution nature in plating are conducted at the effect of electromagnetic fields. The mechanisms leading to microscopic degradation of plating and edge effects origin are detected.

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2000 10th International Crimean Microwave Conference. "Microwave and Telecommunication Technology". Conference Proceedings (IEEE Cat. No.00EX415)

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