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引用次数: 2
摘要
本文介绍了用于二维显示的LED集成聚合物微机电系统(MEMS)的工艺发展和初步实验结果。所提出的集成系统由于制造简单和选用聚合物材料作为结构层而成本低廉，与现有的平板显示器相比，它是具有相似性能的强有力的候选。提出了一种实现LED芯片与基于pcb的MEMS结构集成的工艺技术。第一个版本的MEMS结构通过消耗11.5 mW来驱动，由此产生的位移测量为9毫米。加上250 μ m × 250 μ m的LED芯片尺寸，可实现36像素的分辨率。
This study presents the process development and first experimental results of LED integrated polymer microelectromechanical systems (MEMS) for two-dimensional displays. Proposed integrated system is very cheap due to the fabrication simplicity and the choice of polymer material as the structural layer, and it is a strong candidate to show similar performance when compared with the existing flat panel displays. A process technology that enables the integration of the LED dies and the PCB-based MEMS structure is presented. The very first version of the MEMS structure is actuated by consuming 11.5 mW and resulting displacement is measured to be 9 mm. Along with the LED die size of 250 mum times 250 mum, 36 pixels of resolution can be achieved.
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