Yingda Dong, Z. Griffith, M. Dahlstrom, M. Rodwell
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引用次数: 7
摘要
基极-集电极结电容(C/sub bc/)是限制HBT高频性能的关键因素。为了降低C/sub bc/,我们采用选择性离子注入和MBE再生的方法,在HBT的本质区下建立了一个集电极基座,这是III-V型HBT中首次报道的这种结构。其设计使得HBT的外源区耗尽集电极厚度远大于HBT的本征区耗尽集电极厚度,从而大大降低了外源基-集电极电容。虽然C/sub bc/也可以通过在发射极下形成一个狭窄的N+子集电极条带来降低(M. Sokolich等人,第25届IEEE GaAsIC会议),但这种结构可能由于长而窄的N+层而产生较大的集电极接入电阻Rc。然而,与标准台面结构相比,集电极基座结构不会显著增加集电极接入电阻,因此是Si/SiGe技术中最广泛采用的方法。我们早前报道了具有低泄漏和良好直流特性的集电极基座HBTs (Y. Dong et al., Proc. 2003 Int.)。Semicond。Dev. Res. Symp,第348-349页,2003年);在这里,我们报告了预期C/sub bc/大幅降低的设备。
C/sub bc/ reduction in InP heterojunction bipolar transistor with selectively implanted collector pedestal
The base-collector junction capacitance (C/sub bc/) is a key factor limiting HBT high frequency performance. To reduce C/sub bc/, we report an HBT structure with a collector pedestal under the HBT's intrinsic region by using selective ion implantation and MBE regrowth, the first such structure reported in III-V HBTs. It is designed so that the depleted collector thickness in HBT's extrinsic region is much larger than the depleted collector thickness in HBT's intrinsic region, and therefore substantially reducing the extrinsic base-collector capacitance. Although C/sub bc/ can also be reduced by forming a narrow N+ subcollector stripe lying under the emitter (M. Sokolich et al., 25th IEEE GaAsIC Symp.), such structures can have large collector access resistance Rc arising from long, narrow N+ layer. The collector pedestal structure, however, does not significantly increase collector access resistance relative to a standard mesa structure, and is consequently the approach most widely employed in Si/SiGe technology. We had earlier reported collector pedestal HBTs with low leakage and good DC characteristics (Y. Dong et al., Proc. 2003 Int. Semicond. Dev. Res. Symp., pp. 348-349, 2003); here we report devices with the expected large reduction in C/sub bc/.