超薄铁电非掺杂HfO2用于mfset高速低压工作

Joong‐Won Shin, Masakazu Tanuma, J. Pyo, S. Ohmi
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引用次数: 0

摘要

由于低结晶温度和抑制硅衬底之间SiO2界面层(IL)的形成,研究了铁电非掺杂HfO2在金属-铁电-半导体场效应晶体管(mfset)中的应用。我们利用5nm厚的未掺杂HfO2对铁电栅绝缘子进行标化,实现了mfset,并通过减少Pt栅电极沉积的溅射损伤来提高铁电性能[1]。然而,受mfset界面特性影响的低频噪声变得非常重要,特别是对于缩放器件[2]。在本研究中,我们研究了溅射功率对形成5nm厚的HfO2栅极绝缘子以实现mfset高速工作的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultrathin Ferroelectric Nondoped HfO2 for MFSFET with High-speed and Low-voltage Operation
Ferroelectric nondoped HfO2 has been investigated for metal-ferroelectric-semiconductor field-effect transistor (MFSFET) application due to the low crystallization temperature and the suppression of SiO2 interfacial layer (IL) formation between HfO2 and Si substrate. We realized MFSFET with the scaling of ferroelectric gate insulator utilizing 5 nm thick nondoped HfO2, and the ferroelectric property was improved by decreasing the sputtering damage of Pt gate electrode deposition [1]. However, the low frequency noise affected by interfacial property of MFSFET becomes important, especially for scaled device [2]. In this research, we investigated the effects of sputtering power for 5 nm thick HfO2 gate insulator formation to realize high-speed operation of MFSFET.
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