低成本的无铅焊料，适用于EE行业

2002 IEEE International Conference on Industrial Technology, 2002. IEEE ICIT '02. Pub Date : 2002-12-11 DOI:10.1109/ICIT.2002.1189347

C. Thanachayanont, N. Ramungul

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引用次数: 5

摘要

近年来，人们越来越意识到电气和电子设备中铅的使用限制。本文综述了几种替代SnPb焊料的新材料。这包括所选择的二元和三元材料系统的相图，相关的微观结构，因此，机械性能的细节。虽然SnAgCu合金似乎是SnPb合金最合适的替代品，但在成本方面，SnCu似乎是更好的候选者。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Low-cost lead-free solder for EE industries

Recently, there has been an increasing awareness of restrictions of lead usage in electrical and electronic equipments. In this paper, materials proposed to replace SnPb solder were reviewed. This includes details of phase diagrams of chosen binary and ternary material systems, relevant microstructures and, hence, mechanical properties. Although, SnAgCu alloy seems to be the most appropriate replacement for SnPb alloy, in terms of cost, SnCu seems to be a better candidate.

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2002 IEEE International Conference on Industrial Technology, 2002. IEEE ICIT '02.

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