{"title":"电力电子应用中提高IGBT可靠性的研究","authors":"V. Sundaramoorthy, E. Bianda, G. Riedel","doi":"10.1109/SMICND.2015.7355149","DOIUrl":null,"url":null,"abstract":"Lifetime prediction of IGBT modules from their junction temperature is an important aspect to improve the reliability of power electronic systems. Here, methods to estimate the IGBT junction temperature from its electrical characteristics are discussed. A solution is also proposed to avoid explosion of IGBTs used in traction converters.","PeriodicalId":325576,"journal":{"name":"2015 International Semiconductor Conference (CAS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A study to improve IGBT reliability in power electronics applications\",\"authors\":\"V. Sundaramoorthy, E. Bianda, G. Riedel\",\"doi\":\"10.1109/SMICND.2015.7355149\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Lifetime prediction of IGBT modules from their junction temperature is an important aspect to improve the reliability of power electronic systems. Here, methods to estimate the IGBT junction temperature from its electrical characteristics are discussed. A solution is also proposed to avoid explosion of IGBTs used in traction converters.\",\"PeriodicalId\":325576,\"journal\":{\"name\":\"2015 International Semiconductor Conference (CAS)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 International Semiconductor Conference (CAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2015.7355149\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International Semiconductor Conference (CAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2015.7355149","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A study to improve IGBT reliability in power electronics applications
Lifetime prediction of IGBT modules from their junction temperature is an important aspect to improve the reliability of power electronic systems. Here, methods to estimate the IGBT junction temperature from its electrical characteristics are discussed. A solution is also proposed to avoid explosion of IGBTs used in traction converters.