60 GHz封装LTCC网格阵列天线与放大器的集成

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI:10.1109/EDAPS.2017.8277055

Pengfei Sun, Tang Liu, Jian Zhang, Linpu Huang

{"title":"60 GHz封装LTCC网格阵列天线与放大器的集成","authors":"Pengfei Sun, Tang Liu, Jian Zhang, Linpu Huang","doi":"10.1109/EDAPS.2017.8277055","DOIUrl":null,"url":null,"abstract":"This paper presents an integration of a 60 GHz packaged low-temperature cofired ceramic (LTCC) grid array antenna (GAA) with a power amplifier under the concept of antenna-in-package. The demonstrated single GAA has a measured maximum gain of 15.12dB at 60GHz, with an accepted impedance bandwidth from 58 to 61 GHz and ±15° half-power beam width (HPBW). Vertical vias and wire-bonding are used to realize low-loss interconnection between the amplifier and the GAA. The measured results indicate that the maximum gain is 26.4dB when the packaged GAA is working as the transmitter, and the maximum gain is 25.69dB when the packaged GAA is working as the receiver, which is 11.28dB and 10.57dB respectively higher than the single GAA. These results clearly demonstrate the feasibility and potential of the solution for the 60 GHz front-end integration and package.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Integration of a 60 GHz packaged LTCC grid array antenna with an amplifier\",\"authors\":\"Pengfei Sun, Tang Liu, Jian Zhang, Linpu Huang\",\"doi\":\"10.1109/EDAPS.2017.8277055\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an integration of a 60 GHz packaged low-temperature cofired ceramic (LTCC) grid array antenna (GAA) with a power amplifier under the concept of antenna-in-package. The demonstrated single GAA has a measured maximum gain of 15.12dB at 60GHz, with an accepted impedance bandwidth from 58 to 61 GHz and ±15° half-power beam width (HPBW). Vertical vias and wire-bonding are used to realize low-loss interconnection between the amplifier and the GAA. The measured results indicate that the maximum gain is 26.4dB when the packaged GAA is working as the transmitter, and the maximum gain is 25.69dB when the packaged GAA is working as the receiver, which is 11.28dB and 10.57dB respectively higher than the single GAA. These results clearly demonstrate the feasibility and potential of the solution for the 60 GHz front-end integration and package.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277055\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277055","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文提出了一种60 GHz封装低温共烧陶瓷(LTCC)栅格阵列天线(GAA)与功率放大器在封装天线概念下的集成。所演示的单GAA在60GHz时的测量最大增益为15.12dB，可接受的阻抗带宽为58至61 GHz，半功率波束宽度(HPBW)为±15°。采用垂直通孔和线键连接实现放大器与GAA之间的低损耗互连。测量结果表明，封装GAA作为发射器时的最大增益为26.4dB，封装GAA作为接收器时的最大增益为25.69dB，分别比单个GAA高11.28dB和10.57dB。这些结果清楚地证明了该解决方案在60ghz前端集成和封装方面的可行性和潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Integration of a 60 GHz packaged LTCC grid array antenna with an amplifier

This paper presents an integration of a 60 GHz packaged low-temperature cofired ceramic (LTCC) grid array antenna (GAA) with a power amplifier under the concept of antenna-in-package. The demonstrated single GAA has a measured maximum gain of 15.12dB at 60GHz, with an accepted impedance bandwidth from 58 to 61 GHz and ±15° half-power beam width (HPBW). Vertical vias and wire-bonding are used to realize low-loss interconnection between the amplifier and the GAA. The measured results indicate that the maximum gain is 26.4dB when the packaged GAA is working as the transmitter, and the maximum gain is 25.69dB when the packaged GAA is working as the receiver, which is 11.28dB and 10.57dB respectively higher than the single GAA. These results clearly demonstrate the feasibility and potential of the solution for the 60 GHz front-end integration and package.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

自引率

0.00%

发文量