Chuantong Chen, Zheng Zhang, Yang Liu, K. Suganuma
{"title":"用于高温SiC功率模块的裸DBA衬底上的微片状银膏烧结","authors":"Chuantong Chen, Zheng Zhang, Yang Liu, K. Suganuma","doi":"10.23919/ICEP55381.2022.9795371","DOIUrl":null,"url":null,"abstract":"In this study, Ag flake particles paste sinter joining on a bare DBA (Al/AlN/Al) substrate at temperature of 250 °C without pressure was achieved with a robust shear strength of 33.6 MPa in a SiC power module. The microstructure of sintered Ag and the bonded interface of Ag/Al indicated that the excellent sinter ability of the Ag paste. The Ag nanoparticles were in-situ-formed from the Ag flake particles, which tight bonding to the Al surface. High-temperature reliability of the SiC-DBA joint structure were investigated by high-temperature aging at 250 °C, and thermal shock test from -50 to 250 °C. The shear strength still larger than 30 MPa after 1000 h aging. Large deformation of Al layer occurred after thermal shock test, leading to the interface cracks generation and shear strength decrease.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules\",\"authors\":\"Chuantong Chen, Zheng Zhang, Yang Liu, K. Suganuma\",\"doi\":\"10.23919/ICEP55381.2022.9795371\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, Ag flake particles paste sinter joining on a bare DBA (Al/AlN/Al) substrate at temperature of 250 °C without pressure was achieved with a robust shear strength of 33.6 MPa in a SiC power module. The microstructure of sintered Ag and the bonded interface of Ag/Al indicated that the excellent sinter ability of the Ag paste. The Ag nanoparticles were in-situ-formed from the Ag flake particles, which tight bonding to the Al surface. High-temperature reliability of the SiC-DBA joint structure were investigated by high-temperature aging at 250 °C, and thermal shock test from -50 to 250 °C. The shear strength still larger than 30 MPa after 1000 h aging. Large deformation of Al layer occurred after thermal shock test, leading to the interface cracks generation and shear strength decrease.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795371\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795371","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules
In this study, Ag flake particles paste sinter joining on a bare DBA (Al/AlN/Al) substrate at temperature of 250 °C without pressure was achieved with a robust shear strength of 33.6 MPa in a SiC power module. The microstructure of sintered Ag and the bonded interface of Ag/Al indicated that the excellent sinter ability of the Ag paste. The Ag nanoparticles were in-situ-formed from the Ag flake particles, which tight bonding to the Al surface. High-temperature reliability of the SiC-DBA joint structure were investigated by high-temperature aging at 250 °C, and thermal shock test from -50 to 250 °C. The shear strength still larger than 30 MPa after 1000 h aging. Large deformation of Al layer occurred after thermal shock test, leading to the interface cracks generation and shear strength decrease.
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