电子传输阴极的金刚石键合和金属化

IVESC 2012 Pub Date : 2012-04-24 DOI:10.1109/IVESC.2012.6264196

J. Shaw, F. Wood, J. Yater, K. Jensen, B. Pate, J. Hanna, R. Myers, T. Feigelson

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引用次数: 1

摘要

我们报告了在更大的衬底上以允许电子束放大的方式安装小薄金刚石片的进展。除了物理安装之外，我们的键合方法必须兼容负电子亲和表面的创建和维护以及在高温下的操作。我们使用一种瞬态液相键合方法，其中组成金属反应以提高其熔点并降低其蒸气压。

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Diamond bonding and metallization for electron transmission cathodes

We report progress in mounting small thin diamond sheets over holes in larger substrates in a manner that allows electron beam amplification. In addition to a physical mount, our bonding method must be compatible with the creation and maintenance of the negative electron affinity surface and operation at elevated temperatures. We use a transient liquid phase bonding method wherein the constituent metals react to increase their melting point and also reduce their vapor pressure.

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IVESC 2012

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