50GHz以下tsv的双t型等效电路建模方法

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI:10.1109/EDAPS.2017.8277026

Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu

{"title":"50GHz以下tsv的双t型等效电路建模方法","authors":"Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu","doi":"10.1109/EDAPS.2017.8277026","DOIUrl":null,"url":null,"abstract":"The three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology offer a solution to meet the continuously increasing demand on high-speed electronic products. In order to comprehensively evaluate the signal transmission of TSV in increasing signal frequency, accuracy equivalent circuit model is necessary. In this paper, a method of double-T type equivalent circuit modelling for TSVs is proposed and applied to coaxial TSV and ground-signal (GS)-type TSVs. Furthermore, the transmission parameters (S21) of the double-T models are evaluated by SPICE and compared with the results of 3-D full-wave electromagnetic field simulation (HFSS). The good accordance of the results up to 50GHz verifies the accuracy of the proposed method.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Double-T type equivalent circuit modelling method for TSVs up to 50GHz\",\"authors\":\"Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu\",\"doi\":\"10.1109/EDAPS.2017.8277026\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology offer a solution to meet the continuously increasing demand on high-speed electronic products. In order to comprehensively evaluate the signal transmission of TSV in increasing signal frequency, accuracy equivalent circuit model is necessary. In this paper, a method of double-T type equivalent circuit modelling for TSVs is proposed and applied to coaxial TSV and ground-signal (GS)-type TSVs. Furthermore, the transmission parameters (S21) of the double-T models are evaluated by SPICE and compared with the results of 3-D full-wave electromagnetic field simulation (HFSS). The good accordance of the results up to 50GHz verifies the accuracy of the proposed method.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277026\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277026","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

基于硅通孔(TSV)技术的三维集成电路(3D ic)为满足高速电子产品不断增长的需求提供了解决方案。为了全面评价TSV在增加信号频率时的信号传输情况，需要建立精度等效电路模型。本文提出了一种TSV双t型等效电路建模方法，并将其应用于同轴TSV和地信号(GS)型TSV。利用SPICE计算了双t模型的传输参数S21，并与三维全波电磁场仿真(HFSS)结果进行了比较。在50GHz范围内的结果吻合良好，验证了所提方法的准确性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Double-T type equivalent circuit modelling method for TSVs up to 50GHz

The three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology offer a solution to meet the continuously increasing demand on high-speed electronic products. In order to comprehensively evaluate the signal transmission of TSV in increasing signal frequency, accuracy equivalent circuit model is necessary. In this paper, a method of double-T type equivalent circuit modelling for TSVs is proposed and applied to coaxial TSV and ground-signal (GS)-type TSVs. Furthermore, the transmission parameters (S21) of the double-T models are evaluated by SPICE and compared with the results of 3-D full-wave electromagnetic field simulation (HFSS). The good accordance of the results up to 50GHz verifies the accuracy of the proposed method.

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2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

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