高速互连多通孔耦合建模

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967636

Chung-Chi Huang, L. Tsang, D. Miller, A. Tripathi

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引用次数: 5

摘要

多通孔耦合建模是高速互连系统设计中的一个重要问题。众所周知，通孔间耦合对高速电路的信号完整性有不可忽视的影响。本文基于双耦合通孔模型，研究了一阶多通孔耦合问题。分析结果与实验数据进行了比较。得到了梯形输入和高斯输入下反射和透射的瞬态波形。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modeling of multi-vias coupling for high speed interconnects

Modeling of multiple via coupling is an important problem in the design of high-speed interconnect systems. It is known that the inter-via coupling has non-negligible effects on the signal integrity of high-speed circuits. In this paper, we investigate first order multi-via coupling based on a two-coupled-vias model. Analytical results are compared with experimental data up to 5GHz. Transient waveforms were obtained for reflection and transmission for trapezoidal and Gaussian input.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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