SOI T-RAM存储技术中用于后门控制的衬底掺杂优化

M. Ershov, F. Nemati, R. Gupta, V. Gopalakrishnan, R. Gooty, M. Tarabbia, K. Yang, S. Banna, D. Hayes, H. Cho, S. Robins
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引用次数: 3

摘要

本文介绍了SOI T-RAM技术中衬底掺杂优化的各种考虑。在SOI T-RAM技术中使用后门(衬底电压)控制来优化电池特性。然而,首次报道了用于SOI逻辑技术的典型低掺杂衬底可以在T-RAM电池中产生异常缓慢的瞬态效应。衬底掺杂的优化解决了这一缓慢瞬态问题,改善了SOI T-RAM存储阵列的后门控制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of substrate doping for back-gate control in SOI T-RAM memory technology
This paper presents various considerations for substrate doping optimization in SOI T-RAM technology. Back gate (substrate voltage) control is used in an SOI T-RAM technology for optimizing cell characteristics. However, it is reported for the first time that typical low-doped substrates used in SOI logic technologies can create unusually slow transient effects in T-RAM cell. It is also demonstrated that the optimization of substrate doping resolves this slow transient problem and improves back gate control of SOI T-RAM memory arrays.
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