通过弥合处理器和内存之间的差距，使计算机系统的性能提高了1000倍

2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) Pub Date : 2017-10-01 DOI:10.1109/S3S.2017.8309202

Z. Or-Bach

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引用次数: 9

摘要

40多年来，计算机处理速度和内存访问之间的差距以每年约50%的速度增长，到今天已经超过1000倍。这为增强单核系统性能提供了绝佳的机会。提出了一种创新的3D集成技术，结合重新构建集成存储设备，以弥合差距，并使计算机系统的改进提高1000倍。所提议的技术利用了广泛可用的工艺，可以在很短的时间内集成到产品中。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A 1,000x improvement in computer systems by bridging the processor-memory gap

For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.

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来源期刊

2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

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