{"title":"介电阶跃应力与寿命应力比较","authors":"A. Strong, E. Wu, R. Bolam","doi":"10.1109/IRWS.1995.493602","DOIUrl":null,"url":null,"abstract":"Voltage life-stress results have been compared with voltage step stress results. The figure of merit chosen for this comparison was TDDB. Two different oxides were used, one having a thickness of 13.5 nm and the other having a thickness of 8.2 nm.","PeriodicalId":355898,"journal":{"name":"IEEE 1995 International Integrated Reliability Workshop. Final Report","volume":"144 9-10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Dielectric step stress and life stress comparison\",\"authors\":\"A. Strong, E. Wu, R. Bolam\",\"doi\":\"10.1109/IRWS.1995.493602\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Voltage life-stress results have been compared with voltage step stress results. The figure of merit chosen for this comparison was TDDB. Two different oxides were used, one having a thickness of 13.5 nm and the other having a thickness of 8.2 nm.\",\"PeriodicalId\":355898,\"journal\":{\"name\":\"IEEE 1995 International Integrated Reliability Workshop. Final Report\",\"volume\":\"144 9-10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 1995 International Integrated Reliability Workshop. Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.1995.493602\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1995 International Integrated Reliability Workshop. Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1995.493602","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Voltage life-stress results have been compared with voltage step stress results. The figure of merit chosen for this comparison was TDDB. Two different oxides were used, one having a thickness of 13.5 nm and the other having a thickness of 8.2 nm.
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