采用替代通道、替代金属栅极和无锗局部互连技术在45nm翅片间距上制备应变锗量子阱p- finfet

L. Witters, J. Mitard, R. Loo, S. Demuynck, S. Chew, T. Schram, Z. Tao, A. Hikavyy, J. W. Sun, A. Milenin, H. Mertens, C. Vrancken, P. Favia, M. Schaekers, H. Bender, N. Horiguchi, R. Langer, K. Barla, D. Mocuta, N. Collaert, A. Thean
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引用次数: 38

摘要

应变松弛SiGe上的应变Ge p沟道finfet首次在高密度45nm翅片间距上集成,采用Si衬底上的替代沟道方法。与我们之前在隔离sGe finfet[1]上的工作相比,我们实现了14/16nm技术节点兼容模块,如替换金属栅极和无锗本地互连。离子/IOFF基准测试表明,高密度应变Ge p- finfet在SiGe器件上的性能优于已发表的最佳隔离应变Ge。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Strained germanium quantum well p-FinFETs fabricated on 45nm Fin pitch using replacement channel, replacement metal gate and germanide-free local interconnect
Strained Ge p-channel FinFETs on Strain Relaxed SiGe are integrated for the first time on high density 45nm Fin pitch using a replacement channel approach on Si substrate. In comparison to our previous work on isolated sGe FinFETs [1], 14/16nm technology node compatible modules such as replacement metal gate and germanide-free local interconnect were implemented. The ION/IOFF benchmark shows the high density strained Ge p-FinFETs in this work outperform the best published isolated strained Ge on SiGe devices.
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