si厚度对si钝化Ge pmosfet界面和器件性能的影响

K. Martens, J. Mitard, B. de Jaeger, M. Meuris, H. Maes, G. Groeseneken, F. Minucci, F. Crupi
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引用次数: 16

摘要

采用全电导技术研究了外延生长硅层的锗pmosfet的半导体-介电界面钝化。该技术解决了在使用经典psila电导技术时出现的替代mos接口的几个问题。迁移率随si钝化厚度的变化可以用界面态密度的变化来解释。观察到的阈值电压位移作为si钝化厚度的函数也可以与界面态密度随厚度的变化联系起来。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of Si-thickness on interface and device properties for Si-passivated Ge pMOSFETs
The semiconductor-dielectric interface passivation of Ge pMOSFETs with an epitaxially grown Si-layer is studied by means of the full conductance technique. This technique resolves several issues which occur for alternative MOS-interfaces when using the dasiaclassicalpsila conductance technique. The observed mobility behavior as a function of Si-passivation thickness can be explained by the observed variation in interface state density. Observed threshold voltage shifts as a function of Si-passivation thickness can also be linked to the variation in interface state density with thickness.
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