高k介电介质对短沟道MOSFET低-高掺杂谱线阈值电压偏移的影响

R. Dhar, P. Halder, A. Deyasi
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引用次数: 0

摘要

以Hf02、Al2O3和SiO2为介电材料,在低-高掺杂的短沟道MOSFET中获得了负尺度的阈值电压偏移。考虑植入深度小于耗尽深度且浓度较低,求解泊松方程时需满足反演条件,并将理论结果与理想片荷近似得到的结果进行比较。在实际范围内改变结构参数和掺杂参数,测量相应的电压位移。植入深度和耗尽宽度都是用底物浓度变化来测量的。结果表明,增强型MOSFET可用于删除模式的工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Role of High-K Dielectric on Threshold Voltage Shift for Low-High Doping Profile in Short-Channel MOSFET
Threshold voltage shift on negative scale is obtained in short-channel MOSFET with low-high doping profile considering Hf02, Al2O3 and SiO2 as dielectric materials. Considering implant depth less than depletion depth along with lower concentration, Poisson's equation is solved subject to inversion condition where theoretical findings are compared with that obtained by ideal sheet charge approximation. Structural and doping parameters are altered within practical range, and corresponding voltage shift is measured. Both implant depth and depletion width are measured with substrate concentration variation. Results reveal that the enhancement MOSFET can be used for deletion mode of operation.
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