多核架构中热缓解技术快速原型设计和评估的仿真框架

Tanguy Sassolas, C. Sandionigi, Alexandre Guerre, Julien Mottin, P. Vivet, H. Boussetta, N. Peltier
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引用次数: 2

摘要

现代soc的特点是功率密度增加,因此温度升高,通过其封装直接影响器件的性能,可靠性和成本。在设计流程中,当优化机会最高时,需要尽早预测和缓解热问题。在本文中,我们提出了一个基于高级SystemC虚拟样机与高效功率和热仿真工具紧密耦合的动态热缓解方案设计的有效框架。通过与SThorm 64核架构的芯片比较,我们展示了该方法的优势,并提供了仿真速度结果,使其成为流程早期热缓解设计的可靠解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A simulation framework for rapid prototyping and evaluation of thermal mitigation techniques in many-core architectures
Modern SoCs are characterized by increasing power density and consequently increasing temperature, that directly impacts performances, reliability and cost of a device through its packaging. Thermal issues need to be predicted and mitigated as early as possible in the design flow, when the optimization opportunities are the highest. In this paper, we present an efficient framework for the design of dynamic thermal mitigation schemes based on a high-level SystemC virtual prototype tightly coupled with efficient power and thermal simulation tools. We demonstrate the benefit of our approach through silicon comparison with the SThorm 64-core architecture and provide simulation speed results making it a sound solution for the design of thermal mitigation early in the flow.
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