高性能低漏增强模式高k介电GaN moshemt,用于节能,紧凑型稳压器和RF功率放大器,用于低功耗移动soc

H. Then, L. Chow, S. Dasgupta, S. Gardner, M. Radosavljevic, V. Rao, S. Sung, G. Yang, R. Chau
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引用次数: 16

摘要

我们制作了LG=90nm高k介电增强模式(e-mode) GaN MOS-HEMT,在0.55W/mm (VD=3.5V, VG=0V)的RF输出功率密度(RF Pout)下,具有低IOFF=70nA/μm (VD=3.5V, VG=0V),低RON=490Ω-μm,高ID,max=1.4mA/μm,优异的功率附加效率(PAE)达80%。这些结果表明:(i)在等效击穿电压(BVD)下的RON比工业标准Si稳压器(VR)晶体管低>3.6倍,(ii)在匹配RF Pout下的PAE比工业标准GaAs RF功率放大器(PA)晶体管高>10%,在匹配PAE下的RF Pout比工业标准GaAs RF功率放大器(PA)晶体管高>50%,所有这些都是在移动soc兼容电压下。这些结果使得GaN mos - hemt在实现移动SoC的节能、紧凑稳压器和射频功率放大器方面具有吸引力。这项工作首次表明,GaN电子产品的应用空间可以扩展到现有的高压电源和射频电子产品(例如汽车,电源转换,基站,雷达)之外,包括低功耗移动soc。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-performance low-leakage enhancement-mode high-K dielectric GaN MOSHEMTs for energy-efficient, compact voltage regulators and RF power amplifiers for low-power mobile SoCs
We have fabricated LG=90nm high-K dielectric enhancement-mode (e-mode) GaN MOS-HEMT which shows low IOFF=70nA/μm (VD=3.5V, VG=0V), low RON=490Ω-μm, high ID,max=1.4mA/μm, and excellent power-added efficiency (PAE) of 80% at RF output power density (RF Pout) of 0.55W/mm (VD=3.5V, f=2.0GHz). These results represent (i) >3.6X lower RON at equivalent breakdown voltage (BVD) than industry-standard Si voltage regulator (VR) transistors, and (ii) >10% better PAE at matched RF Pout or >50% higher RF Pout at matched PAE than industry-standard GaAs RF power amplifier (PA) transistors, all at mobile SoC-compatible voltages. These results make GaN MOS-HEMTs attractive for realizing energy-efficient, compact voltage regulators and RF power amplifiers for mobile SoC. This work shows, for the first time, that the application space of GaN electronics can be expanded beyond the existing high-voltage power and RF electronics (e.g. automobile, power conversion, base-station, radar) to include low-power mobile SoCs.
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