波峰焊和回流焊pwa的水清洗评价

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122195

G. Castelli, G. Specchiulli

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引用次数: 2

摘要

作者报告了在1989年第一季度开始的一个测试程序中使用生产机器获得的结果。首先对不同种类的市售水溶性焊锡膏和助焊剂进行了化学和物理评价。选择了三种产品进行测试，以确定其在专业领域的波峰焊和回流工艺的应用资格，并将它们与标准的CFC(氯氟烃)清洁程序进行比较。离子污染和THB(温度-湿度偏差)测试在特别设计的pwa(印刷布线组件)上进行。结果发现，只要洗衣机具有合适的喷雾压力、喷嘴角度和干燥段，水溶性产品就能获得可接受的清洁度。正在对部件进行可靠性测试，以评估存在水分时残留污染物可能产生的有害影响。给出了这一步骤的初步结果

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Assessment of aqueous cleaning of PWAs with wave and reflow soldered components

The authors report results obtained using production machines in a test program that started in the first quarter of 1989. Chemical and physical evaluation of different kinds of commercial water-soluble solder creams and fluxes was first performed. Three products were selected and subjected to test in order to qualify their application in the professional field for wave soldering and reflow processes, and they were compared to the standard CFC (chlorofluorocarbon) cleaning procedure. Ionic contamination and THB (temperature-humidity-bias) tests were performed on ad hoc designed PWAs (printed wiring assemblies). It was found that acceptable cleanliness is obtained with water-soluble products provided that the washing machine has suitable spray pressure, nozzle angles, and drying section. Reliability tests on components are in progress to evaluate the possible detrimental effects of residual contaminants when moisture is present. Preliminary results of this step are given.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量