{"title":"功率SOI结构中掺杂物重分布的新模型","authors":"T. Ishiyama, S. Matsumoto, T. Yachi, W. Fichtner","doi":"10.1109/ISPSD.1999.764102","DOIUrl":null,"url":null,"abstract":"We propose an interlayer model of the SOI structure during annealing, that explains the phosphorus pile-up and boron segregation that occurs in the SOI structure. Simulated dopant profiles based on the model showed its usefulness in predicting the electrical characteristics of SOI power devices.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new model for dopant redistribution in a power SOI structure\",\"authors\":\"T. Ishiyama, S. Matsumoto, T. Yachi, W. Fichtner\",\"doi\":\"10.1109/ISPSD.1999.764102\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose an interlayer model of the SOI structure during annealing, that explains the phosphorus pile-up and boron segregation that occurs in the SOI structure. Simulated dopant profiles based on the model showed its usefulness in predicting the electrical characteristics of SOI power devices.\",\"PeriodicalId\":352185,\"journal\":{\"name\":\"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1999.764102\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1999.764102","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new model for dopant redistribution in a power SOI structure
We propose an interlayer model of the SOI structure during annealing, that explains the phosphorus pile-up and boron segregation that occurs in the SOI structure. Simulated dopant profiles based on the model showed its usefulness in predicting the electrical characteristics of SOI power devices.