F. Doany, C. Schow, J. Kash, C. Baks, R. Budd, P. Pepeljugoski, D. Kuchta, R. Dangel, F. Horst, B. Offrein
{"title":"Terabus: 160gb /s双向板级光数据总线","authors":"F. Doany, C. Schow, J. Kash, C. Baks, R. Budd, P. Pepeljugoski, D. Kuchta, R. Dangel, F. Horst, B. Offrein","doi":"10.1109/LEOS.2007.4382521","DOIUrl":null,"url":null,"abstract":"A chip-to-chip optical interconnect on a printed circuit board achieves a 160-Gb/s aggregate bidirectional data rate through 32 parallel polymer waveguides at 13.5 mW/Gb/s. This is the fastest, widest, and most integrated optical bus ever demonstrated.","PeriodicalId":110592,"journal":{"name":"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Terabus: A 160-Gb/s Bidirectional Board-Level Optical Data Bus\",\"authors\":\"F. Doany, C. Schow, J. Kash, C. Baks, R. Budd, P. Pepeljugoski, D. Kuchta, R. Dangel, F. Horst, B. Offrein\",\"doi\":\"10.1109/LEOS.2007.4382521\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A chip-to-chip optical interconnect on a printed circuit board achieves a 160-Gb/s aggregate bidirectional data rate through 32 parallel polymer waveguides at 13.5 mW/Gb/s. This is the fastest, widest, and most integrated optical bus ever demonstrated.\",\"PeriodicalId\":110592,\"journal\":{\"name\":\"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOS.2007.4382521\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOS.2007.4382521","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Terabus: A 160-Gb/s Bidirectional Board-Level Optical Data Bus
A chip-to-chip optical interconnect on a printed circuit board achieves a 160-Gb/s aggregate bidirectional data rate through 32 parallel polymer waveguides at 13.5 mW/Gb/s. This is the fastest, widest, and most integrated optical bus ever demonstrated.