{"title":"电子信号的问题与展望[VLSI]","authors":"J. Poulton","doi":"10.1109/ARVLSI.1999.833402","DOIUrl":null,"url":null,"abstract":"Summary form only given, as follows. The growing gap between on-chip gates and off-chip I/O bandwidth is reaching crisis proportions, yet signaling system designers continue to use inefficient and inappropriate circuit techniques for many chip-to-chip interconnections. For example, most chip-to-chip interconnect still uses CMOS inverters as transmitters and receivers, even though it would be difficult to imagine more unfavorable components for a signaling system. Processor-to-memory and processor-to-processor communication systems are still almost universally built using physical buses, transmission lines with multiple loads attached along their length. Though logically simple and convenient, these structures impose fundamental limits on signal speed that preclude their use above about 1-2 Gbaud, exact a heavy price in power dissipation, and are very difficult to engineer. Some have suggested replacing electrical signaling with optical interconnect; however, converting between optical and electrical signals is still expensive, and in any case, electrical signaling is far from its theoretical limits. With reasonable assumptions, the wiring embedded in a typical circuit board has bisection bandwidth of order 10 s of Tbit/s. Recent advances in high-speed serial link techniques point the way to unlocking a substantial fraction of this bandwidth. In CMOS, 1-2 Gbit/s links are fairly common, experimental 4 Gb/sec links have been demonstrated, and speeds up to 20 Gbits/s appear quite feasible.","PeriodicalId":358015,"journal":{"name":"Proceedings 20th Anniversary Conference on Advanced Research in VLSI","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Problems and prospects for electrical signaling [VLSI]\",\"authors\":\"J. Poulton\",\"doi\":\"10.1109/ARVLSI.1999.833402\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given, as follows. The growing gap between on-chip gates and off-chip I/O bandwidth is reaching crisis proportions, yet signaling system designers continue to use inefficient and inappropriate circuit techniques for many chip-to-chip interconnections. For example, most chip-to-chip interconnect still uses CMOS inverters as transmitters and receivers, even though it would be difficult to imagine more unfavorable components for a signaling system. Processor-to-memory and processor-to-processor communication systems are still almost universally built using physical buses, transmission lines with multiple loads attached along their length. Though logically simple and convenient, these structures impose fundamental limits on signal speed that preclude their use above about 1-2 Gbaud, exact a heavy price in power dissipation, and are very difficult to engineer. Some have suggested replacing electrical signaling with optical interconnect; however, converting between optical and electrical signals is still expensive, and in any case, electrical signaling is far from its theoretical limits. With reasonable assumptions, the wiring embedded in a typical circuit board has bisection bandwidth of order 10 s of Tbit/s. Recent advances in high-speed serial link techniques point the way to unlocking a substantial fraction of this bandwidth. In CMOS, 1-2 Gbit/s links are fairly common, experimental 4 Gb/sec links have been demonstrated, and speeds up to 20 Gbits/s appear quite feasible.\",\"PeriodicalId\":358015,\"journal\":{\"name\":\"Proceedings 20th Anniversary Conference on Advanced Research in VLSI\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-03-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 20th Anniversary Conference on Advanced Research in VLSI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARVLSI.1999.833402\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 20th Anniversary Conference on Advanced Research in VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARVLSI.1999.833402","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
仅给出摘要形式,如下。片上门和片外I/O带宽之间日益增长的差距正在达到危机的程度,然而信号系统设计者继续使用低效和不适当的电路技术来实现许多芯片到芯片的互连。例如,大多数芯片对芯片互连仍然使用CMOS逆变器作为发射器和接收器,尽管很难想象信号系统中有更不利的组件。处理器到存储器和处理器到处理器的通信系统仍然几乎普遍地使用物理总线构建,沿着它们的长度附加多个负载的传输线。虽然逻辑上简单方便,但这些结构对信号速度施加了基本限制,使其无法在1-2 Gbaud以上使用,在功耗方面付出了沉重的代价,并且很难设计。有人建议用光互连代替电信号;然而,光信号和电信号之间的转换仍然是昂贵的,无论如何,电信号远未达到其理论极限。在合理的假设下,嵌入在典型电路板中的布线具有10 s Tbit/s的等分带宽。高速串行链路技术的最新进展指出了解锁大部分带宽的方法。在CMOS中,1-2 Gbit/s的链路是相当普遍的,实验性的4 Gb/s链路已经被证明,高达20 Gbit/s的速度似乎是相当可行的。
Problems and prospects for electrical signaling [VLSI]
Summary form only given, as follows. The growing gap between on-chip gates and off-chip I/O bandwidth is reaching crisis proportions, yet signaling system designers continue to use inefficient and inappropriate circuit techniques for many chip-to-chip interconnections. For example, most chip-to-chip interconnect still uses CMOS inverters as transmitters and receivers, even though it would be difficult to imagine more unfavorable components for a signaling system. Processor-to-memory and processor-to-processor communication systems are still almost universally built using physical buses, transmission lines with multiple loads attached along their length. Though logically simple and convenient, these structures impose fundamental limits on signal speed that preclude their use above about 1-2 Gbaud, exact a heavy price in power dissipation, and are very difficult to engineer. Some have suggested replacing electrical signaling with optical interconnect; however, converting between optical and electrical signals is still expensive, and in any case, electrical signaling is far from its theoretical limits. With reasonable assumptions, the wiring embedded in a typical circuit board has bisection bandwidth of order 10 s of Tbit/s. Recent advances in high-speed serial link techniques point the way to unlocking a substantial fraction of this bandwidth. In CMOS, 1-2 Gbit/s links are fairly common, experimental 4 Gb/sec links have been demonstrated, and speeds up to 20 Gbits/s appear quite feasible.