{"title":"FlexRAM:迈向先进的智能存储系统:回顾论文","authors":"J. Torrellas","doi":"10.1109/ICCD.2012.6378607","DOIUrl":null,"url":null,"abstract":"For conventional memory use, this design improves bandwidth, latency and energy characteristics - without changing the high-volume DRAM design. However, it is easy to imagine how to augment the capabilities of the logic die to support Intelligent Memory Operations. These can consist of preprocessing the data as it is read from the DRAM stack into the processor chip. They can also involve performing operations in place on the DRAM data.","PeriodicalId":313428,"journal":{"name":"2012 IEEE 30th International Conference on Computer Design (ICCD)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":"{\"title\":\"FlexRAM: Toward an advanced Intelligent Memory system: A retrospective paper\",\"authors\":\"J. Torrellas\",\"doi\":\"10.1109/ICCD.2012.6378607\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For conventional memory use, this design improves bandwidth, latency and energy characteristics - without changing the high-volume DRAM design. However, it is easy to imagine how to augment the capabilities of the logic die to support Intelligent Memory Operations. These can consist of preprocessing the data as it is read from the DRAM stack into the processor chip. They can also involve performing operations in place on the DRAM data.\",\"PeriodicalId\":313428,\"journal\":{\"name\":\"2012 IEEE 30th International Conference on Computer Design (ICCD)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-09-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"27\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 30th International Conference on Computer Design (ICCD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2012.6378607\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 30th International Conference on Computer Design (ICCD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2012.6378607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
FlexRAM: Toward an advanced Intelligent Memory system: A retrospective paper
For conventional memory use, this design improves bandwidth, latency and energy characteristics - without changing the high-volume DRAM design. However, it is easy to imagine how to augment the capabilities of the logic die to support Intelligent Memory Operations. These can consist of preprocessing the data as it is read from the DRAM stack into the processor chip. They can also involve performing operations in place on the DRAM data.