Reliability prediction of electronic packages

An overview is presented of the state of the art in generating analytical models for fatigue life estimation due to mechanical wear-out. The applicability of these models to reliability prediction for electronic packages is examined. In discussing the failure mechanics of common electronic materials, it is convenient to classify the fatigue damage models into brittle damage, ductile damage, and damage in heterogeneous composite materials. Often the failure may not be in the bulk of any individual material but at the interface of two or more materials, and may require a fourth type of damage model.<>