{"title":"基于混合DLL锁定结构的金属氧化物薄膜触觉反馈24V薄膜超声驱动器","authors":"Jonas Pelgrims, K. Myny, W. Dehaene","doi":"10.1109/ESSCIRC55480.2022.9911408","DOIUrl":null,"url":null,"abstract":"This paper presents a 24V high voltage (HV) ultrasonic driver for haptic feedback, designed to drive piezo-electric micromachined ultrasonic transducers (PMUT) using a unipolar 0.8um indium-galium-zinc-oxide (IGZO) thin-film transistor technology fabricated on a polymer substrate. A new hybrid DLL architecture is proposed to overcome the IGZO technology's shortcomings and leverage the accuracy and speed capabilities of Silicon technology. The ultrasonic driver is able to drive a transducer capacitance up to 36pF with a 4bit phase resolution and a frequency of 250kHz occupying a pitch matched area per pixel of $800\\mu\\mathrm{m}\\times 800\\mu m$. This work presents the first fully integrated high-voltage ultrasonic driver in thin-film technology, further expanding the possible applications for thin-film technologies.","PeriodicalId":168466,"journal":{"name":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 24V Thin-Film Ultrasonic Driver for Haptic Feedback in Metal-Oxide Thin-Film Technology using Hybrid DLL Locking Architecture\",\"authors\":\"Jonas Pelgrims, K. Myny, W. Dehaene\",\"doi\":\"10.1109/ESSCIRC55480.2022.9911408\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a 24V high voltage (HV) ultrasonic driver for haptic feedback, designed to drive piezo-electric micromachined ultrasonic transducers (PMUT) using a unipolar 0.8um indium-galium-zinc-oxide (IGZO) thin-film transistor technology fabricated on a polymer substrate. A new hybrid DLL architecture is proposed to overcome the IGZO technology's shortcomings and leverage the accuracy and speed capabilities of Silicon technology. The ultrasonic driver is able to drive a transducer capacitance up to 36pF with a 4bit phase resolution and a frequency of 250kHz occupying a pitch matched area per pixel of $800\\\\mu\\\\mathrm{m}\\\\times 800\\\\mu m$. This work presents the first fully integrated high-voltage ultrasonic driver in thin-film technology, further expanding the possible applications for thin-film technologies.\",\"PeriodicalId\":168466,\"journal\":{\"name\":\"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-09-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSCIRC55480.2022.9911408\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC55480.2022.9911408","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 24V Thin-Film Ultrasonic Driver for Haptic Feedback in Metal-Oxide Thin-Film Technology using Hybrid DLL Locking Architecture
This paper presents a 24V high voltage (HV) ultrasonic driver for haptic feedback, designed to drive piezo-electric micromachined ultrasonic transducers (PMUT) using a unipolar 0.8um indium-galium-zinc-oxide (IGZO) thin-film transistor technology fabricated on a polymer substrate. A new hybrid DLL architecture is proposed to overcome the IGZO technology's shortcomings and leverage the accuracy and speed capabilities of Silicon technology. The ultrasonic driver is able to drive a transducer capacitance up to 36pF with a 4bit phase resolution and a frequency of 250kHz occupying a pitch matched area per pixel of $800\mu\mathrm{m}\times 800\mu m$. This work presents the first fully integrated high-voltage ultrasonic driver in thin-film technology, further expanding the possible applications for thin-film technologies.
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