性能驱动的斯坦纳路由的最新发展:概述

M. Borah, R. Owens, M. J. Irwin
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引用次数: 0

摘要

互连延迟对电路级延迟的贡献随着最小特征尺寸的增大而增大。在较大的特征尺寸下,互连延迟的贡献很小,而驱动器电阻与导线电阻相比非常大。因此,一个简单的集总模型足以评估和优化电路延迟。然而,在亚微米制程中,互连延迟的贡献主导了级延迟,导线电阻变得明显,使得互连延迟依赖于路由拓扑。因此,有必要使用更精确的模型来估计和优化互连延迟。本文综述了为优化电路性能而生成片上互连拓扑的最新技术进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recent developments in performance driven Steiner routing: an overview
The contribution of interconnect delay to the stage delay of a circuit is increasing with scaling of the minimum feature size. At larger feature size the interconnect delay contribution was small and the driver resistance was very large compared to wire resistance. Consequently, a simple lumped model was sufficient for evaluating and optimizing circuit delay. However, with sub-micron processes, the contribution of interconnect delay dominates the stage delay and the wire resistance becomes noticeable, making the interconnect delay dependent on the routing topology. Hence it is becoming necessary to use a more accurate model for estimating and optimizing interconnect delay. This paper surveys the recent advancements in techniques for generating on-chip interconnect topology for optimizing circuit performance.
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