电子封装电磁分析的平行迭代分层介质积分方程求解器

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI:10.1109/EPEPS.2017.8329759

C. Liu, K. Aygün, H. Braunisch, V. Okhmatovski, A. Yılmaz

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引用次数: 5

摘要

提出了一种大型电子封装多端口网络参数提取的并行迭代求解器。所提出的求解器基于频域积分方程公式，该公式使用平面层状介质格林函数来考虑衬底，使用阻抗边界条件来考虑导体损耗/粗糙度，使用非辐射集总端口模型来考虑端口截断。采用稀疏预条件和基于fft的矩阵向量乘法算法加速并行迭代解。可扩展性研究表明，求解器适用于分析高保真度和大规模的封装模型。

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A parallel iterative layered-medium integral-equation solver for electromagnetic analysis of electronic packages

A parallel iterative solver for multiport network parameter extraction of large-scale electronic packages is presented. The proposed solver is based on a frequency-domain integral-equation formulation that accounts for the substrate using planar layered-medium Green's functions, conductor loss/ roughness using an impedance boundary condition, and port truncations using a non-radiating lumped port model. The parallel iterative solution is accelerated by a sparse preconditioner and an FFT-based matrix-vector multiplication algorithm. A scalability study demonstrates the solver's suitability for analyzing high-fidelity and large-scale package models.

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来源期刊

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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