{"title":"用相邻温度传感器检测功率半导体中键合线故障","authors":"Nils-Malte Jahn, M. Pfost","doi":"10.1109/EPTC56328.2022.10013223","DOIUrl":null,"url":null,"abstract":"In this work, a method for the detection of detached bond wires from the chip of a discrete power semiconductor is presented. For this, differences in the thermal behavior caused by manipulated bond wires are detected with four external temperature sensors adjacent to the device. For experimental verification of this method, multiple test devices with varying bond wire faults are subjected to a power pulse and the temperature response is recorded. Two different concepts for the interpretation of the measured data are presented. The suitability of both concepts is discussed and the sensor requirements for a successful fault detection are evaluated.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"196 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Detection of Bond Wire Failure in Power Semiconductors by Adjacent Temperature Sensors\",\"authors\":\"Nils-Malte Jahn, M. Pfost\",\"doi\":\"10.1109/EPTC56328.2022.10013223\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a method for the detection of detached bond wires from the chip of a discrete power semiconductor is presented. For this, differences in the thermal behavior caused by manipulated bond wires are detected with four external temperature sensors adjacent to the device. For experimental verification of this method, multiple test devices with varying bond wire faults are subjected to a power pulse and the temperature response is recorded. Two different concepts for the interpretation of the measured data are presented. The suitability of both concepts is discussed and the sensor requirements for a successful fault detection are evaluated.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"196 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013223\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013223","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Detection of Bond Wire Failure in Power Semiconductors by Adjacent Temperature Sensors
In this work, a method for the detection of detached bond wires from the chip of a discrete power semiconductor is presented. For this, differences in the thermal behavior caused by manipulated bond wires are detected with four external temperature sensors adjacent to the device. For experimental verification of this method, multiple test devices with varying bond wire faults are subjected to a power pulse and the temperature response is recorded. Two different concepts for the interpretation of the measured data are presented. The suitability of both concepts is discussed and the sensor requirements for a successful fault detection are evaluated.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
