传输线脉冲和人体模型试验用静电试验装置

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) Pub Date : 2018-03-01 DOI:10.1109/ICMTS.2018.8383762

R. Ashton, Stephen Fairbanks, Adam Bergen, E. Grund

{"title":"传输线脉冲和人体模型试验用静电试验装置","authors":"R. Ashton, Stephen Fairbanks, Adam Bergen, E. Grund","doi":"10.1109/ICMTS.2018.8383762","DOIUrl":null,"url":null,"abstract":"New two two-pin ESD testers are capable of doing both Transmission Line Pulse (TLP) and Human Body Model (HBM) testing at wafer level. These systems facilitate using test structures to link fundamental circuit element parameters measured with TLP and expected HBM results on final products.","PeriodicalId":271839,"journal":{"name":"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electrostatic test structures for transmission line pulse and human body model testing at wafer level\",\"authors\":\"R. Ashton, Stephen Fairbanks, Adam Bergen, E. Grund\",\"doi\":\"10.1109/ICMTS.2018.8383762\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New two two-pin ESD testers are capable of doing both Transmission Line Pulse (TLP) and Human Body Model (HBM) testing at wafer level. These systems facilitate using test structures to link fundamental circuit element parameters measured with TLP and expected HBM results on final products.\",\"PeriodicalId\":271839,\"journal\":{\"name\":\"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2018.8383762\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2018.8383762","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

新的两个双引脚ESD测试仪能够在晶圆级进行传输线脉冲(TLP)和人体模型(HBM)测试。这些系统有助于使用测试结构将测量的基本电路元件参数与TLP和最终产品的预期HBM结果联系起来。

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Electrostatic test structures for transmission line pulse and human body model testing at wafer level

New two two-pin ESD testers are capable of doing both Transmission Line Pulse (TLP) and Human Body Model (HBM) testing at wafer level. These systems facilitate using test structures to link fundamental circuit element parameters measured with TLP and expected HBM results on final products.

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来源期刊

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)

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