基于单片微波集成电路的x波段功率放大模块的研制

2020 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF) Pub Date : 2020-06-01 DOI:10.1109/WECONF48837.2020.9131489

S. I. Shershnev, T. E. Koksharov, M. Vaganov

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引用次数: 0

摘要

分析了低温共烧陶瓷材料在微波器件和天线开发中的优势。提出了一种采用集成电路的带有罗杰斯4003C衬底的x波段放大器模块的实施例。对该模块的实验验证结果进行了分析。

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Development of X-Band Power Amplifier Module Based on Monolithic Microwave Integrated Circuit

The advantages of using low temperature co-fired ceramic materials in the development of microwave devices and antennas are considered. An embodiment of the X-band amplifier module with a Rogers 4003C substrate using an integrated circuit is proposed. The obtained results of the experimental verification of the module are analyzed.

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来源期刊

2020 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF)

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