{"title":"印刷配线板在硅胶中的蠕电击穿特性","authors":"Takahiko Maeda, K. Haga, T. Maeda","doi":"10.1109/ISEIM.1995.496567","DOIUrl":null,"url":null,"abstract":"We measure the creepage breakdown characteristics of printed wiring boards in silicone gel and obtain an experimental equation. This equation allows us to consider separately the different factors (creepage distance, intrinsic capacity, relative permittivity, insulation layer thickness and electrode location) affecting breakdown voltage. Further, we are able to predict accurately the breakdown limit of insulation in two planes.","PeriodicalId":130178,"journal":{"name":"Proceedings of 1995 International Symposium on Electrical Insulating Materials","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Creepage breakdown characteristics of printed wiring board in silicone gel\",\"authors\":\"Takahiko Maeda, K. Haga, T. Maeda\",\"doi\":\"10.1109/ISEIM.1995.496567\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We measure the creepage breakdown characteristics of printed wiring boards in silicone gel and obtain an experimental equation. This equation allows us to consider separately the different factors (creepage distance, intrinsic capacity, relative permittivity, insulation layer thickness and electrode location) affecting breakdown voltage. Further, we are able to predict accurately the breakdown limit of insulation in two planes.\",\"PeriodicalId\":130178,\"journal\":{\"name\":\"Proceedings of 1995 International Symposium on Electrical Insulating Materials\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1995 International Symposium on Electrical Insulating Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEIM.1995.496567\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 International Symposium on Electrical Insulating Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEIM.1995.496567","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Creepage breakdown characteristics of printed wiring board in silicone gel
We measure the creepage breakdown characteristics of printed wiring boards in silicone gel and obtain an experimental equation. This equation allows us to consider separately the different factors (creepage distance, intrinsic capacity, relative permittivity, insulation layer thickness and electrode location) affecting breakdown voltage. Further, we are able to predict accurately the breakdown limit of insulation in two planes.
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