用于3D集成的超薄晶圆的机械研磨

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) Pub Date : 2000-05-14 DOI:10.1109/ICMEL.2000.838728

S. Pinel, J. Tasselli, J. Bailbé, A. Marty, P. Puech, D. Estève

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引用次数: 7

摘要

本文提出了一种新技术，用于细化到10 /spl mu/m，并处理各种半导体器件，并将其转移到宿主衬底上。采用优化的机械研磨法去除晶圆。

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Mechanical lapping of ultra-thin wafers for 3D integration

This paper presents a new technique for thinning down up to 10 /spl mu/m and handling various semiconductor devices, and transferring them onto host substrates. An optimized mechanical lapping is used to remove the wafer.

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来源期刊

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)

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