W. A. Sasangka, C. Gan, C. Thompson, W. Choi, J. Wei
{"title":"焊接温度和时效温度对Cu与75Sn25In钎料结合强度的影响","authors":"W. A. Sasangka, C. Gan, C. Thompson, W. Choi, J. Wei","doi":"10.1109/EPTC.2009.5416527","DOIUrl":null,"url":null,"abstract":"In the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the obtained results. The bonding mechanism is proposed to occur over 2 stages: • An increase in bonding temperatures leads to an increase in the true contact area, and • The aging temperature leads to interdiffusion and assists formation of the IMC. The type of IMC that forms is η phase (Cu6(Sn,In)5) which is similar to the interaction between Cu and eutectic Sn-In. The shear strength increases with increasing the bonding temperature. On the other hand, the aging temperature does not have a significant impact on the shear strength. This indicates that the shear strength is mostly affected by the true contact area rather than the IMC formation.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders\",\"authors\":\"W. A. Sasangka, C. Gan, C. Thompson, W. Choi, J. Wei\",\"doi\":\"10.1109/EPTC.2009.5416527\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the obtained results. The bonding mechanism is proposed to occur over 2 stages: • An increase in bonding temperatures leads to an increase in the true contact area, and • The aging temperature leads to interdiffusion and assists formation of the IMC. The type of IMC that forms is η phase (Cu6(Sn,In)5) which is similar to the interaction between Cu and eutectic Sn-In. The shear strength increases with increasing the bonding temperature. On the other hand, the aging temperature does not have a significant impact on the shear strength. This indicates that the shear strength is mostly affected by the true contact area rather than the IMC formation.\",\"PeriodicalId\":256843,\"journal\":{\"name\":\"2009 11th Electronics Packaging Technology Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 11th Electronics Packaging Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2009.5416527\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 11th Electronics Packaging Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2009.5416527","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders
In the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the obtained results. The bonding mechanism is proposed to occur over 2 stages: • An increase in bonding temperatures leads to an increase in the true contact area, and • The aging temperature leads to interdiffusion and assists formation of the IMC. The type of IMC that forms is η phase (Cu6(Sn,In)5) which is similar to the interaction between Cu and eutectic Sn-In. The shear strength increases with increasing the bonding temperature. On the other hand, the aging temperature does not have a significant impact on the shear strength. This indicates that the shear strength is mostly affected by the true contact area rather than the IMC formation.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
