测试和质量的相互作用

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI:10.1109/TEST.1991.519794

P. Maxwell

{"title":"测试和质量的相互作用","authors":"P. Maxwell","doi":"10.1109/TEST.1991.519794","DOIUrl":null,"url":null,"abstract":"From the perspective of manufacturing environments, the production of integrated circuits is unique, and presents significant challenges. The fundamental problem is that the process by which these ICs are made introduces so many defects into the part being manufactured that we are lucky if we get as many as half of the produced parts being defect-free. For large, complex chips the situation is considerably worse.","PeriodicalId":272630,"journal":{"name":"1991, Proceedings. International Test Conference","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"THE INTERACTION OF TEST AND QUALITY\",\"authors\":\"P. Maxwell\",\"doi\":\"10.1109/TEST.1991.519794\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"From the perspective of manufacturing environments, the production of integrated circuits is unique, and presents significant challenges. The fundamental problem is that the process by which these ICs are made introduces so many defects into the part being manufactured that we are lucky if we get as many as half of the produced parts being defect-free. For large, complex chips the situation is considerably worse.\",\"PeriodicalId\":272630,\"journal\":{\"name\":\"1991, Proceedings. International Test Conference\",\"volume\":\"65 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-10-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1991, Proceedings. International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1991.519794\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1991, Proceedings. International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1991.519794","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

从制造环境的角度来看，集成电路的生产是独特的，并提出了重大的挑战。最根本的问题是，制造这些集成电路的过程给正在制造的零件带来了如此多的缺陷，如果我们能得到多达一半的生产零件是无缺陷的，我们就很幸运了。对于大型、复杂的芯片，情况要糟糕得多。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

THE INTERACTION OF TEST AND QUALITY

From the perspective of manufacturing environments, the production of integrated circuits is unique, and presents significant challenges. The fundamental problem is that the process by which these ICs are made introduces so many defects into the part being manufactured that we are lucky if we get as many as half of the produced parts being defect-free. For large, complex chips the situation is considerably worse.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

1991, Proceedings. International Test Conference

自引率

0.00%

发文量