柔性混合电子可靠性研究进展

2017 IEEE Workshop on Microelectronics and Electron Devices (WMED) Pub Date : 2017-03-01 DOI:10.1109/WMED.2017.7916924

Darrell E. Leber, Richard L. Chaney, D. Hackler, Brian N. Meek, Seth D. Leija, K. DeGregorio, S. Wald, Dale G. Wilson

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引用次数: 7

摘要

柔性混合电子结合了印刷电子和硅集成电路的最佳特性，以创建高性能，超薄，物理灵活的系统。正在开发测试和方法来评估这些系统的可靠性。给出了柔性混合电子系统的初步结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Advances in Flexible Hybrid Electronics Reliability

Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. Tests and methods are being developed to evaluate the reliability of these systems. Initial results are presented for flexible hybrid electronics systems.

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来源期刊

2017 IEEE Workshop on Microelectronics and Electron Devices (WMED)

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