InAs/AlSb hemt的直流和射频低温行为

G. Moschetti, P. Nilsson, L. Desplanque, X. Wallart, H. Rodilla, J. Mateos, J. Grahn
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引用次数: 1

摘要

报道了在低温条件下(6 K)工作的InAs/AlSb hemt的直流和射频特性,漏源偏置高达0.3 V。与室温(300 K)相比,器件性能有了很大的改善:更低的Ron,更低的gds,更明显的Ids (Vds)特性的变化,fT增加,栅极泄漏电流降低了两个数量级以上。这使得InAs/AlSb HEMT技术在具有高功耗限制的低温低噪声放大器设计中备受关注。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC and RF cryogenic behaviour of InAs/AlSb HEMTs
DC and RF properties are reported for InAs/AlSb HEMTs operating under cryogenic conditions (6 K) for a drain source bias up to 0.3 V. Compared to room temperature (300 K), a large improvement in device properties was observed: lower Ron, lower gds, a more distinct knee in the Ids (Vds) characteristics, increased fT and a reduction of the gate leakage current of more than two orders of magnitude. This makes InAs/AlSb HEMT technology of large interest in cryogenic low-noise amplifier designs with high constraints on power dissipation.
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