{"title":"环境试验中塑料IC封装内机械应变的实验和数学测定及其对器件的影响","authors":"R. Usell, S. A. Smiley","doi":"10.1109/IRPS.1981.362976","DOIUrl":null,"url":null,"abstract":"Methods to quantify mechanical strains in plastic encapsulated devices (PEDs) are described. Calculations of strain-producing tendencies of encapsulants from material properties and processes are given. Measurements of die strain as a function of encapsulant, processing, and environmental exposure are presented. Possible mechanisms for gap formation between chip and encapsulant during autoclave tests are described.","PeriodicalId":376954,"journal":{"name":"19th International Reliability Physics Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1981-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"57","resultStr":"{\"title\":\"Experimental and Mathematical Determination of Mechanical Strains within Plastic IC Packages and Their Effect on Devices During Environmental Tests\",\"authors\":\"R. Usell, S. A. Smiley\",\"doi\":\"10.1109/IRPS.1981.362976\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Methods to quantify mechanical strains in plastic encapsulated devices (PEDs) are described. Calculations of strain-producing tendencies of encapsulants from material properties and processes are given. Measurements of die strain as a function of encapsulant, processing, and environmental exposure are presented. Possible mechanisms for gap formation between chip and encapsulant during autoclave tests are described.\",\"PeriodicalId\":376954,\"journal\":{\"name\":\"19th International Reliability Physics Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1981-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"57\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1981.362976\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1981.362976","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental and Mathematical Determination of Mechanical Strains within Plastic IC Packages and Their Effect on Devices During Environmental Tests
Methods to quantify mechanical strains in plastic encapsulated devices (PEDs) are described. Calculations of strain-producing tendencies of encapsulants from material properties and processes are given. Measurements of die strain as a function of encapsulant, processing, and environmental exposure are presented. Possible mechanisms for gap formation between chip and encapsulant during autoclave tests are described.
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