{"title":"多芯片组件互连技术(ITMA)-英国信息技术工程理事会混合晶圆规模项目","authors":"D. Pedder","doi":"10.1109/ICWSI.1993.255269","DOIUrl":null,"url":null,"abstract":"The Interconnection technology for multichip assemblies (ITMA) project is addressing the application of a silicon-substrate-based multichip module (MCM) technology to the requirements of parallel computing applications in the UK. The program involves activities on MCM design methodology, silicon substrate process technology, device assembly, module packaging technology, the design of VLSI devices specifically for MCM applications, and the implementation of advanced MCM demonstrator modules in parallel computing systems. The objectives of the ITMA project are described, and the technologies employed within the project to realize high-performance MCMs and hybrid wafer scale integration (HWSI) modules are reviewed.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Interconnection technologies for multichip assemblies (ITMA)-A UK Information Technology Engineering Directorate hybrid wafer scale project\",\"authors\":\"D. Pedder\",\"doi\":\"10.1109/ICWSI.1993.255269\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Interconnection technology for multichip assemblies (ITMA) project is addressing the application of a silicon-substrate-based multichip module (MCM) technology to the requirements of parallel computing applications in the UK. The program involves activities on MCM design methodology, silicon substrate process technology, device assembly, module packaging technology, the design of VLSI devices specifically for MCM applications, and the implementation of advanced MCM demonstrator modules in parallel computing systems. The objectives of the ITMA project are described, and the technologies employed within the project to realize high-performance MCMs and hybrid wafer scale integration (HWSI) modules are reviewed.<<ETX>>\",\"PeriodicalId\":377227,\"journal\":{\"name\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"volume\":\"46 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-01-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1993.255269\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255269","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnection technologies for multichip assemblies (ITMA)-A UK Information Technology Engineering Directorate hybrid wafer scale project
The Interconnection technology for multichip assemblies (ITMA) project is addressing the application of a silicon-substrate-based multichip module (MCM) technology to the requirements of parallel computing applications in the UK. The program involves activities on MCM design methodology, silicon substrate process technology, device assembly, module packaging technology, the design of VLSI devices specifically for MCM applications, and the implementation of advanced MCM demonstrator modules in parallel computing systems. The objectives of the ITMA project are described, and the technologies employed within the project to realize high-performance MCMs and hybrid wafer scale integration (HWSI) modules are reviewed.<>
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
