离子注入退火过程中硼失活/活化动力学模拟

S. Chakravarthi, S. Dunham
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引用次数: 2

摘要

硼瞬态增强扩散(TED)的特征是增强的尾部扩散加上一个与过量间隙存在的硼簇相关的电非活性不动峰。过程模拟的一致模型必须考虑到离子注入后与过量点缺陷浓度相关的各种团块的形成。这些包括间隙团簇(例如{311}缺陷)、空位团簇和掺杂物/间隙团簇(例如硼间隙团簇)。除了化学剖面(SIMS)之外,预测电激活行为也很重要。因此,在这项工作中,我们研究了退火过程中硼失活和随后活化的模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling of boron deactivation/activation kinetics during ion implant annealing
Boron transient enhanced diffusion (TED) is characterized by enhanced tail diffusion coupled with an electrically inactive immobile peak associated with the clustering of boron in the presence of excess interstitials. A consistent model for process simulation has to account for the formation of a variety of agglomerates associated with the excess point defect concentrations following ion implantation. These include interstitial clusters (e.g. {311} defects), vacancy clusters and dopant/interstitial clusters (e.g. boron interstitial clusters). In addition to the chemical profiles (SIMS), it is essential to also predict electrical activation behavior. Hence, in this work we investigate models for boron deactivation and subsequent activation during annealing.
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