超薄钆(Gd/sub 2/O/sub 3/)掺杂HfO/sub 2/ n- mosfet的结构优化和电学特性研究

S. Rhee, H. Kim, C. Kang, C. Choi, M. Akbar, M. Zhang, T. Lee, I. Ok, F. Zhu, S. Krishnan, J.C. Lee
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引用次数: 4

摘要

首次研究了Gd2O3掺杂HfO2多金属介电n- mosfet的新结构方法及其电学特性。在三种可能的介质结构中,顶部Gd2O3和底部HfO2双层介质表现出最好的EOT和漏电流特性。这种Gd2O /HfO2电介质的缩小导致EOT的超薄状态(在5Aring和10Aring之间),与HfO2相比,泄漏电流大大降低。此外,研究人员还观察到Gd2O3/HfO2的MOSFET特性有改善的输出电流、跨导性和沟道电子迁移率
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Structural optimization and electrical characteristics of ultra-thin gadolinium (Gd/sub 2/O/sub 3/) incorporated HfO/sub 2/ n-MOSFETs
New structural approach of Gd2O3 incorporated HfO2 multi-metal dielectric n-MOSFETs and their electrical characteristics are investigated for the first time. Among three possible dielectric structures, top Gd2O3 with bottom HfO2 bi-layer dielectric shows the best EOT and leakage current characteristics. Scaling-down of this Gd2O 3/HfO2 dielectric result in ultra-thin regime of EOT (between 5Aring and 10Aring) with substantial reduction in leakage current compared to HfO2. Also promising MOSFET characteristics with improved output current, transconductance, and channel electron mobility for Gd2O3/HfO2 are observed
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