两种焊料合金的热-机械蠕变

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678932

W. Ren, Z. Qian, Sheng Liu

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引用次数: 13

摘要

研究了新型无铅钎料合金80Sn10In9.5Bi0.5Ag和共晶钎料合金63Sn37Pb的热-机械蠕变行为。采用专门设计的薄条形试样和计算机控制的6轴微型疲劳试验机，获得了一系列可靠、一致的蠕变数据。80Sn10In9.5Bi0.5Ag钎料合金表现出非常吸引人的蠕变特性，在电子封装技术中可能具有潜在的应用前景。另一方面，引入了Qian and Liu (1997b)提出的一种新的统一黏塑性本构模型，用于预测共晶钎料合金的蠕变性能。实验数据与模型预测结果非常吻合。还观察到，如果只考虑幂律状态，蠕变破裂时间将明显高估。

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Thermo-mechanical creep of two solder alloys

Thermo-mechanical creep behaviors of a new lead free solder alloy 80Sn10In9.5Bi0.5Ag and eutectic solder alloy 63Sn37Pb are investigated in this paper. By using specially designed thin strip specimens and a computer controlled 6-axis mini fatigue tester, a series of reliable and consistent creep data are obtained. The 80Sn10In9.5Bi0.5Ag solder alloy shows very attractive creep characteristics and may have potential applications in electronics packaging technology. On the other hand, a new unified viscoplastic constitutive model proposed by Qian and Liu (1997b) is introduced to predict the creep properties of eutectic solder alloy. An excellent agreement between experimental data and model predictions is achieved. It is also observed that the creep rupture time will be significantly overpredicted if only power law regime is considered.

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来源期刊

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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