J. Cong, D. Pan, Lei He, Cheng-Kok Koh, Kei-Yong Khoo
{"title":"深亚微米集成电路互连设计","authors":"J. Cong, D. Pan, Lei He, Cheng-Kok Koh, Kei-Yong Khoo","doi":"10.1145/266388.266534","DOIUrl":null,"url":null,"abstract":"Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35 /spl mu/m to 0.07 /spl mu/m projected in the National Technology Roadmap for Semiconductors.","PeriodicalId":187521,"journal":{"name":"1997 Proceedings of IEEE International Conference on Computer Aided Design (ICCAD)","volume":"153 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"199","resultStr":"{\"title\":\"Interconnect design for deep submicron ICs\",\"authors\":\"J. Cong, D. Pan, Lei He, Cheng-Kok Koh, Kei-Yong Khoo\",\"doi\":\"10.1145/266388.266534\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35 /spl mu/m to 0.07 /spl mu/m projected in the National Technology Roadmap for Semiconductors.\",\"PeriodicalId\":187521,\"journal\":{\"name\":\"1997 Proceedings of IEEE International Conference on Computer Aided Design (ICCAD)\",\"volume\":\"153 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"199\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 Proceedings of IEEE International Conference on Computer Aided Design (ICCAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/266388.266534\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings of IEEE International Conference on Computer Aided Design (ICCAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/266388.266534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35 /spl mu/m to 0.07 /spl mu/m projected in the National Technology Roadmap for Semiconductors.