{"title":"利用三维硅技术实现微波收发模块的小型化","authors":"Mikhail D. Pyatochkin, E. Kotlyarov, A. Tishin","doi":"10.1109/MWENT47943.2020.9067346","DOIUrl":null,"url":null,"abstract":"This paper represents modern technologies for assembling transceiver modules APAA, using 3D silicon technology elements. The basic concepts of multi-chip transceiver modules assemblies on а silicon wafer are presented. Actual approaches to reduce the overall transmit-receive module`s dimensions are considered. The heat dissipation simulation results of various designs are given. Traditional and modern approaches to the TRM APAR construction comparative analysis results and the silicon wafer heat removal efficiency is shown.","PeriodicalId":122716,"journal":{"name":"2020 Moscow Workshop on Electronic and Networking Technologies (MWENT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Miniaturization of Microwave Transmit-Receive Modules, Implemented Using 3D Silicon Technology\",\"authors\":\"Mikhail D. Pyatochkin, E. Kotlyarov, A. Tishin\",\"doi\":\"10.1109/MWENT47943.2020.9067346\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper represents modern technologies for assembling transceiver modules APAA, using 3D silicon technology elements. The basic concepts of multi-chip transceiver modules assemblies on а silicon wafer are presented. Actual approaches to reduce the overall transmit-receive module`s dimensions are considered. The heat dissipation simulation results of various designs are given. Traditional and modern approaches to the TRM APAR construction comparative analysis results and the silicon wafer heat removal efficiency is shown.\",\"PeriodicalId\":122716,\"journal\":{\"name\":\"2020 Moscow Workshop on Electronic and Networking Technologies (MWENT)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 Moscow Workshop on Electronic and Networking Technologies (MWENT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWENT47943.2020.9067346\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 Moscow Workshop on Electronic and Networking Technologies (MWENT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWENT47943.2020.9067346","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Miniaturization of Microwave Transmit-Receive Modules, Implemented Using 3D Silicon Technology
This paper represents modern technologies for assembling transceiver modules APAA, using 3D silicon technology elements. The basic concepts of multi-chip transceiver modules assemblies on а silicon wafer are presented. Actual approaches to reduce the overall transmit-receive module`s dimensions are considered. The heat dissipation simulation results of various designs are given. Traditional and modern approaches to the TRM APAR construction comparative analysis results and the silicon wafer heat removal efficiency is shown.
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