AlGaN/GaN hemt在不同过渡缓冲液上的deg行为

Manikant Singh, N. Mohan, R. Soman, Hareesh Chandrasaker, S. Raghavan
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引用次数: 1

摘要

我们报告了在从AlN缓冲液到epi-GaN的不同类型转变上生长的AlGaN/GaN HEMT堆栈的2DEG迁移率和片载流子浓度行为。讨论了每一个转变在界面粗糙度和外延氮化镓结晶度方面的作用。此外,观察到的材料参数与HEMT 2DEG性能相关。无论在HRXRD FWHMs中看到的散射如何,从具有低表面粗糙度的堆中观察到2DEG迁移率的增强。结果表明,除了位错还原和无裂纹膜外,低表面粗糙度对于更好地约束2DEG和最佳载流子浓度是必不可少的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
2DEG behavior of AlGaN/GaN HEMTs on various transition buffers
We are reporting the 2DEG mobility and sheet carrier concentration behavior of AlGaN/GaN HEMT stacks that are grown on different kinds of transitions from AlN buffer to epi-GaN. The role of each transition in terms of interfacial roughness and epi-GaN crystallinity are discussed. Further, the observed material parameters are correlated with the HEMT 2DEG property. Enhancement in 2DEG mobility was observed from the stacks those exhibit low surface roughness irrespective of the scattering seen in HRXRD FWHMs. This results show that other than the dislocation reduction and crack free film, the low surface roughness is essential for a better confinement of 2DEG and an optimum carrier concentration.
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