{"title":"利用海航技术制备固体微针阵列的研究","authors":"N. A. Aziz, B. Majlis","doi":"10.1109/SMELEC.2006.381012","DOIUrl":null,"url":null,"abstract":"This paper presents an approach for the process development of the out of plane silicon microneedles array fabrication. This study utilizes the wet etching technology using HNA to build a structure of sharp-tipped microneedles; biconvex-conical shaped. The height of the fabricated microneedle is 41.8 mum and the tip radii is 1.4 mum. Investigation on the effect of varying the mask opening window had been carried out. The design approach and the fabrication process are well explained here.","PeriodicalId":136703,"journal":{"name":"2006 IEEE International Conference on Semiconductor Electronics","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Fabrication Study of Solid Microneedles Array Using HNA\",\"authors\":\"N. A. Aziz, B. Majlis\",\"doi\":\"10.1109/SMELEC.2006.381012\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an approach for the process development of the out of plane silicon microneedles array fabrication. This study utilizes the wet etching technology using HNA to build a structure of sharp-tipped microneedles; biconvex-conical shaped. The height of the fabricated microneedle is 41.8 mum and the tip radii is 1.4 mum. Investigation on the effect of varying the mask opening window had been carried out. The design approach and the fabrication process are well explained here.\",\"PeriodicalId\":136703,\"journal\":{\"name\":\"2006 IEEE International Conference on Semiconductor Electronics\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE International Conference on Semiconductor Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2006.381012\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Conference on Semiconductor Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2006.381012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication Study of Solid Microneedles Array Using HNA
This paper presents an approach for the process development of the out of plane silicon microneedles array fabrication. This study utilizes the wet etching technology using HNA to build a structure of sharp-tipped microneedles; biconvex-conical shaped. The height of the fabricated microneedle is 41.8 mum and the tip radii is 1.4 mum. Investigation on the effect of varying the mask opening window had been carried out. The design approach and the fabrication process are well explained here.
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