iPROMIS:一个交互式性能驱动的多层MCM路由器

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI:10.1109/MCMC.1993.302132

M. Sriram, S.M. Kang

{"title":"iPROMIS:一个交互式性能驱动的多层MCM路由器","authors":"M. Sriram, S.M. Kang","doi":"10.1109/MCMC.1993.302132","DOIUrl":null,"url":null,"abstract":"Some of the physical design algorithms developed for iPROMIS, an interactive MCM physical design tool under development, are discussed. A performance-driven routing algorithm based on a new second-order delay model for lossy transmission lines and a multilayer assignment algorithm are described. A fast algorithm for computing the step response of interchip interconnections is also presented.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"iPROMIS: an interactive performance driven multilayer MCM router\",\"authors\":\"M. Sriram, S.M. Kang\",\"doi\":\"10.1109/MCMC.1993.302132\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Some of the physical design algorithms developed for iPROMIS, an interactive MCM physical design tool under development, are discussed. A performance-driven routing algorithm based on a new second-order delay model for lossy transmission lines and a multilayer assignment algorithm are described. A fast algorithm for computing the step response of interchip interconnections is also presented.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302132\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302132","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

讨论了为正在开发的交互式MCM物理设计工具iPROMIS开发的一些物理设计算法。提出了一种基于新的二阶时延模型的性能驱动的有耗传输线路由算法和多层分配算法。本文还提出了一种计算片间互连阶跃响应的快速算法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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iPROMIS: an interactive performance driven multilayer MCM router

Some of the physical design algorithms developed for iPROMIS, an interactive MCM physical design tool under development, are discussed. A performance-driven routing algorithm based on a new second-order delay model for lossy transmission lines and a multilayer assignment algorithm are described. A fast algorithm for computing the step response of interchip interconnections is also presented.<>

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Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93

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